Intel’s Foundry Business Fails To Impress Broadcom With Latest 18A Process – Report

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Chip manufacturer Intel Corpration's contract manufacturing plans have apparently been dealt with a setback as wafer tests run by Broadcom's analysts have failed to yield satisfactory results, according to sources quoted by Reuters. These tests covered Intel's leading edge semiconductor technology, 18A, and after Intel shipped its customer the wafers last month, Broadloom's tests concluded that the process technology was not ready to move to high volume production.

Semiconductor production takes place in phases, with high volume production being one of the final stages after chip manufacturers have fine tuned their equipment before feeling comfortable to risk thousands of wafers in production.

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Intel Asserts 18A Is On Track To Enter High Volume Production In 2025

Following its disastrous earnings report in August that saw Intel announce a 15% workforce reduction along with a dividend suspension and meek third quarter guidance, the spotlight is even sharper on the firm's contract manufacturing plans. These plans, part of Intel's Intel Foundry Services Business, seek to emulate the Taiwanese TSMC's successes in the semiconductor industry and offer firms such as NVIDIA, AMD and Broadcom a chance to have their chips manufactured by Intel.

According to three sources quoted by Reuters, Intel used its leading edge 18A manufacturing technology to print circuits on wafers sent by Broadcom before sending them back last month. However, after Broadcom evaluated them, its engineers were doubtful of 18A's ability to move to high volume production.

High volume production is typically one of the final stages in the production process , and success on this front would have provided some much