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Intel Officially Manages To Get A New Financial Lifeline Through CHIPS Act, Gets Additional $3 Billion In Direct Funding

After weeks of urgent negotiations, Intel has finally managed to receive additional grants under the US CHIPS Act, awarded up to a total of $3 billion in direct funding.

Intel Receives New Grants By The Biden Administration To Ensure Chipmaker's Growth & Sustainability

[Press Release]: The Biden-Harris Administration announced today that Intel Corporation has been awarded up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program. The program is designed to expand the trusted manufacturing of leading-edge semiconductors for the U.S. government.

Related Story Intel Arrow Lake Desktop CPUs With Alchemist iGPUs Almost As Fast As GTX 1050 Ti

The Secure Enclave program builds on previous projects between Intel and the Department of Defense (DoD) such as Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) and State-of-the-Art Heterogeneous Integration Prototype (SHIP). As the only American company that both designs and manufactures leading-edge logic chips, Intel will help secure the domestic chip supply chain and collaborate with the DoD to help enhance the resilience of U.S. technological systems by advancing secure, cutting-edge solutions.

The Secure Enclave award is separate from the proposed funding agreement that Intel reached with the Biden-Harris Administration in March of this year to support the construction and modernization of semiconductor commercial fabrication facilities under the CHIPS and Science Act.

Today’s announcement reflects the continued progress of Intel Foundry, which brings together all the components customers need to design and manufacture chips at the leading edge. Intel Foundry is nearing completion of a historic pace of design and process technology innovation with its most advanced technology – Intel 18A – on track for production in 2025. The company, which develops and produces many of the world’s most advanced chips and semiconductor packaging technologies, is advancing critical

Read more on wccftech.com