Samsung’s HBM3E Memory Fails To Pass NVIDIA Qualification Due To Excessive Heat & Power Issues

Samsung's HBM3E memory hasn't been able to pass NVIDIA's qualifications tests, creating new problems for the Korean manufacturer.

Power Consumption & Heat Issues Are The Main Culprit For Qualification Failure In Samsung's HBM3E Memory, NVIDIA Primarily Selects SK Hynix

News surrounding flaws within Samsung's HBM processes surfaced a few weeks ago. Unofficial sources cited that the Korean giant hasn't been able to meet NVIDIA's expectations with its HBM products. However, Reuters has reiterated this development as well, showing that things aren't looking good at Samsung's camp. It's important to note that securing HBM orders from NVIDIA is a vital part of Samsung's strategy for the growth of its memory division, and recent rumors can potentially be a massive setback for the Korean firm.

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Reuters reports that Samsung's HBM3 and HBM3E processes have been a victim of inefficiencies, which is why companies like NVIDIA haven't been able to place huge orders. It is said that there are "heat and power consumption" issues with the HBM products; with that, they have been unable to pass qualification tests set by Team Green. However, in a statement to Reuters by Samsung, the Korean giant said that claims of failing qualifications tests aren't valid and that the firm closely works with partners to optimize its products.

Whether the development is actual or not, it still is a blow for Samsung's HBM products since it would ultimately prevent their mass adoption due to clients being hesitant to follow such reports. However, it is essential to note that failing qualification tests certainly doesn't mean that Samsung's process is flawed; in reality, Samsung has supplied HBM3 memory to AMD for its Instinct MI300X accelerator.

Initial reports suggested that failing tests was associated with how high the bar has been established by NVIDIA's partners like SK hynix, and some