AMD Commits To Using The Most Advanced Process For Each Generation, Will Continue Design, Packing, Assembly Innovations Across All Products

AMD says that it will be using the most advanced process for each generation of products while adopting innovative design technologies.

AMD's Success In The Data Center & Client Segment Is Attributed To Staying Up To Date With The Latest Process Technologies & Design Techniques, Committed To Continuing The Pace In The Coming Years

The launch of AMD's Zen core architecture was a monumental achievement for the red team which has propelled them to great heights over a span of 7 years. At Computex 2024, AMD announced its next chapter of Zen known as Zen 5 which will be adopting TSMC's brand new 4nm and 3nm nodes to continue the high-performance journey & these future products will also use innovative design technologies which have been mentioned by AMD's EVP, Forrest Norrod, who in an interview with The Next Platform comments on the future of AMD's products.

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When asked about how AMD sees Intel's process and product roadmap, particularly the recent Xeon 6 announcements, Forrest commends Intel's aggressive plan and also states that they have the internal thinking to assume that Intel would do everything they say. It's a different matter of whether Intel will hit the goals or time frame for its process technologies and products but to compete with the blue team, the best approach is to believe that it will achieve its goal and design a competing product that excels to that.

Forrest also talks about process and design technologies that are being used by AMD to stay ahead of the competition. There's no doubt that AMD has been the one with the most innovative solutions out in the market.

AMD made chiplets mainstream, they are rolling out a proper CPU and GPU combination in the market (MI300A), something that Intel had planned but ultimately canceled (Falcon Shores XPU), they offer the same Zen ISA for diverse segments with