TSMC’s CEO Visited ASML Headquarters In Secret, Heralding A Possible Change In The Company’s Approach Toward High-NA EUV Lithography

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TSMC has consistently maintained that it can get by quite well without ASML's latest High-NA EUV lithography machines, terming them too expensive to make much economic sense before 2026. Now, however, it appears that the contract chip manufacturer is having second thoughts about this clear-cut stance, as indicated by a secretive visit of its CEO to ASML's headquarters.

TSMC's arch nemesis of sorts, Intel, has staked its very survival on achieving an insurmountable lead in the emerging field of High-NA EUV lithography. In fact, the first few such machines are all destined for Intel's chip fabrication units. Intel intends to experiment with High-NA Extreme Ultraviolet (EUV) lithography within the parameters of its upcoming 18A (1.8 nm) process node before formally incorporating it into its 14A (1.4 nm) manufacturing process.

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In contrast, TSMC has publicly stated that its current lineup of Low-NA EUV lithography machines can support production well into 2026. The company is apparently content with iterative improvements, including multiple masks for greater production efficiency and advanced nano sheet-based transistor designs, for its upcoming A16 process node. The Taiwanese chipmaker also seems to be relying on Super Power Rail backside power delivery, where the power is supplied via the backside of the chip, to boost the performance of its products for AI workloads.

TSMC's CEO Visits ASML Headquarters

This brings us to the crux of the matter. Instead of attending the Technology Symposium 2024, TSMC's CEO, C. C. Wei, visited ASML's headquarters in the Netherlands in secret on the 26th of May. According to Business Korea, some details of Wei's visit could be gleaned