Intel & The Pentagon Deepen Ties To Develop World’s Most Advanced Chips

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Two and a half years after it signed the first phase of the Rapid Assured Microelectronics Prototypes RAMP-C program with the Pentagon, Intel has deepened its partnership with the defense department. Intel, the Pentagon and the national security accelerator program funded by the CHIPS Act have now agreed to work together to produce early test samples of advanced chip manufacturing processes that can only be manufactured in Europe or Asia. As part of a press release, the chip manufacturer shared earlier today that with RAMP-C, the U.S. government will be able to access leading edge chip manufacturing technologies for the first time.

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Phase three of the RAMP-C program will cover prototypes made by Intel's future 18A manufacturing process. These high end chip manufacturing processes are typically used by consumer processors since they use significant amounts of power to run computing and graphics heavy applications.

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Manufacturing 18A chips for national security applications is part of Intel's partnerships with its DIB, or defense industrial base, customers. This list includes contractors Northrop Grumman and Boeing, with consumer firms Microsoft, NVIDIA and IBM part of a broader set of customers that the California based chip manufacturing company is working with to develop the 18A chip manufacturing technology.

This technology is Intel's next-generation process node, and its predecessor, i.e., the 20A process, should enter production in 2024, according to previous statements made by company executives. Intel also shared key details for the 18A late last year, when CEO Patrick Gelsinger revealed that the 18A