Huawei’s Rumored Tri-Fold Smartphone Is Said To Be Too Advanced, Causing Software Adaption And Chipset Thermal Management Issues

The tri-fold form factor is unusual for smartphones, but it can deliver immense utility if the software is optimized and the hardware can keep pace with it. Huawei has been rumored to be working on such a device, but it has likely run into development issues stemming from the advanced form factor, with problems such as software and possibly a lack of an effective cooling solution causing a delay.

Unnamed Huawei tri-fold smartphone to use one of the company’s Kirin 9000 series of chipsets; lack of improved power efficiency likely resulting in heat management problems

Google has released various updates that allow Android to run well with foldable smartphones, but since no manufacturer has even introduced a tri-fold handset, it appears that the company has run into problems. Bear in mind that, unlike other Chinese companies, Huawei’s HarmonyOS relies on the Android Open Source Project platform and runs its own set of applications. According to @jasonwill101’s statement on X, the software adaption has yet to be ‘perfected,’ suggesting that the triple-screen solution might not play well with the operating system.

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Additionally, each of Huawei’s tri-fold displays would likely sport an extreme level of thinness, as making each panel even slightly thicker would increase the total bulk of the device when it is completely folded. Unfortunately, the chipset needs to be found in one of the three panels, and the sheer thinness probably means that there is inadequate cooling for the SoC. The tipster does not mention the exact SoC but says it belongs to the Kirin 9000 series.

Even if it is the latest Kirin 9010, it is mass produced on SMIC’s 7nm process, meaning that it lacks the power efficiency of the competition, like the A17 Pro, Snapdragon 8 Gen 3, and Dimensity 9300+. Naturally, there would be some degree of overheating and Huawei has been most