Dimensity 9400 Scheduled To Launch In October, MediaTek CEO Confident That Flagship SoC Release Will Result In A 50 Percent Year-Over-Year Revenue Increase

MediaTek is going all out with its flagship smartphone chipset release as the Taiwanese fabless semiconductor manufacturer will reportedly introduce its Dimensity 9400 in October. Like Qualcomm’s Snapdragon 8 Gen 4, the upcoming SoC is said to be mass produced on TSMC’s second-generation 3nm process, bringing in a wave of performance and efficiency improvements. MediaTek’s CEO, Rick Tsai, has expressed confidence in the upcoming silicon and believes that the Dimensity 9400’s release will allow the company to experience a 50 percent increase in annual revenue.

Dimensity 9300 alone was previously reported to have generated $1 billion in revenue for MediaTek; company pinning its hopes on the Dimensity 9400 to re-produce previous results

As reported by Commercial Times, during MediaTek’s earnings call on July 31, Tsai noted that the company anticipates a return to regular seasonal patterns in H2 2024, with the fourth quarter largely depending on consumer product demand. Seeing as how the Dimensity 9300 helped MediaTek post a 70 percent revenue growth in 2023, with the chipset alone bringing in $1 billion, the company’s Chief Executive could be under the impression that the Dimensity 9400 will deliver the same success as it is a significantly more advanced SoC.

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Like the Dimensity 9300, the Dimensity 9400 is rumored to lack power-efficient cores, relying solely on performance cores to deliver unrivaled single-core and multi-core performance by taking advantage of ARM’s ‘BlackHawk’ CPU architecture. It is also reported that MediaTek’s flagship silicon will feature the largest die ever, measuring 150mm² and boasting 30 billion transistors, resulting in an enormous cache and upgraded Neural Processing Unit. These upgrades should give the Dimensity 9400 improvements in on-device generative AI capabilities, though we must see how