Apple To Bring 2nm A-Series Chipsets To The iPhone 18 Lineup, But Only Certain Models Will Feature The New Technology Due To High Costs, Claims Analyst

There is a fair amount of uncertainty surrounding which lithography Apple intends to employ for its future iPhone lineup. A recent report mentioned that the technology giant will transition to TSMC’s 2nm process for its A-series of chipsets for the iPhone 17, but one analyst believes otherwise. He claims that the iPhone 18 family will be treated to the cutting-edge silicon, and even then, not all models will be given preference to this technology due to the high costs that will eventually be incurred.

The iPhone 17 will not feature Apple’s cutting-edge 2nm chipsets, as the company will stick with 3nm SoCs, but mass produced on TSMC’s ‘N3P’ node

On X, TF International Securities analyst Ming-Chi Kuo has provided an update concerning Apple’s plans for the iPhone 17 and iPhone 18 series. He states that for next year’s models, the Cupertino firm will leverage TSMC’s 3nm ‘N3P’ process, which is the third iteration of the Taiwanese semiconductor giant’s advanced node. Apple took advantage of the 3nm ‘N3B’ variant for the A17 Pro, followed by the ‘N3E’ process for the M4, A18, and A18 Pro.

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For the A19 and A19 Pro, which are already said to be in development, future buyers who have specifically skipped the iPhone 16 purchase to wait patiently for the iPhone 17 launch next year may be disappointed to learn that Apple will stick with the 3nm technology. Fortunately, it is fair to say that the N3P version will definitely improve over N3E. One reason why Apple could be reluctant to switch to 2nm chipsets for the iPhone 17 lineup so quickly is high wafer costs.

Earlier this year, we reported that each 3nm wafer costs $20,000, so one can immediately summarize that the switch to 2nm will probably be too high for Apple to consider. It is unlikely that with the iPhone 18 release in 2026, those costs will dramatically reduce, but Apple could work out some proposition with TSMC. Even