Intel & The Pentagon Deepen Ties To Develop World’s Most Advanced Chips
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Manufacturing News
AMD Radeon RX 8000 “RDNA 4” GPUs To Utilize 18 Gbps GDDR6 Memory Across Entire Lineup
AMD might be sticking to the good old-fashioned 18 Gbps GDDR6 memory solution for its next-gen RDNA 4 "Radeon RX 8000" GPUs, alleges @Kepler_L2.
DDR5-10000 memory is closer than ever after JEDEC, the managing body of the standard, extends the base DDR5 spec
The march towards DDR5-10000 continues. Although overclockers have already well and truly passed that mark, those kinds of speeds are all but out of reach without extreme cooling and you have the combination of top quality memory and a CPU with an equally good memory controller.
Xiaomi Will Be Qualcomm’s First Smartphone Partner To Announce Its Snapdragon 8 Gen 4 Flagship, Followed By OnePlus
A few of Qualcomm’s phone partners always make an appearance at the company’s annual Snapdragon Summit to reveal which of their devices will be powered by the next flagship chipset. Historically, Xiaomi has always been the first to announce its premium offering for next year, and according to a tipster, the Chinese manufacturer will retain those exclusive rights when it unveils its first Snapdragon 8 Gen 4 smartphone. However, showcasing a launch is one thing, and making it officially available to purchase is another.
Wordle Today: Wordle answer and hints for April 22
We have the solution to Wordle on April 22, as well as some helpful hints to help you figure out the answer yourself, right here. We’ve placed the answer at the bottom of the page, so we don’t ruin the surprise before you’ve had a chance to work through the clues. So let’s dive in, starting with a reminder of yesterday’s answer.
SSD & HDD Prices Could Skyrocket As Seagate & Western Digital Highlight Increased Demand
SSD & HDD prices are expected to skyrocket, with two big manufacturers, Western Digital, and Seagate, anticipating increased demand.
There are few easy ways to get across the incredible complexity required to build a modern computer chip: this photograph is one of them
Chipmaking is tough. Like really tough. Just how tough? An engineer could spend many hours talking about the intricacies of just a single step in the lithographic or packaging process and you'd come away wiser but moderately terrified about the scale of the accomplishments required to create any and all computer chips. But a photograph speaks a thousand words, and these photos of Intel's new lithographic 'High NA EUV' machines make it quite clear how incredibly complex this whole chipmaking biz is.
iPhone 16 To Reportedly Feature Two SiPs Exclusively Supplied By ASE That Will Replace Volume And Power Buttons For Capacitive Solutions
Advanced Semiconductor Engineering, or ASE, has reportedly won an exclusive order from Apple to supply two SiPs, or ‘system in a package’ for the upcoming iPhone 16 series. These chips will serve to replace both the volume and power buttons on the upcoming handsets, presenting capacitive buttons that will deliver extra functionality.