Welcome to WarBulletin - your new best friend in the world of gaming. We're all about bringing you the hottest updates and juicy insights from across the gaming universe. Are you into epic RPG adventures or fast-paced eSports? We've got you covered with the latest scoop on everything from next-level PC gaming rigs to the coolest game releases. But hey, we're more than just news! Ever wondered what goes on behind the scenes of your favorite games? We're talking exclusive interviews with the brains behind the games, fresh off-the-press photos and videos straight from gaming conventions, and, of course, breaking news that you just can't miss. We know you love gaming 24/7, and that's why we're here round the clock, updating you on all things gaming. Whether it's the lowdown on a new patch or the buzz about the next big gaming celeb, we're on it.
AMD is reportedly planning to develop Glass Substrate chips as early as 2025 as Intel & Samsung eye mass production for post-2025.
The third game to be featured in CAPCOM's NEXT showcase beyond Dead Rising Deluxe Remaster and Resident Evil 9 was Kunitsu-Gami: Path of the Goddess.
New benchmarks of AMD's Ryzen AI 9 HX 370 "Strix" APU have leaked out, showcasing some big single & multi-core improvements over Meteor Lake & Hawk Point chips.
The Diablo Immortal team has been diligently monitoring your feedback and working to introduce bug fixes and patches to further improve your playing experience. As we implement these types of changes for the iOS, Android, and PC versions of Immortal, we will update this list.
We've been following SSD prices closely over the past few weeks, months, years even… during which there have been some really bad times, some good times, and some middling times. We're in the middling times now—some NVMe SSDs can be found for decent prices today, though you'll need to spend more than you would have last year to get the same thing. The 4th of July sales haven't really done much to change that, either.
As announced in late June, AMD unveiled an AI-powered method to compress textures called NTBC (Neural Texture Block Compression). Following its presentation at last week's 35th Eurographics Symposium on Rendering, AMD has now released the paper penned by researchers Shin Fujieda and Takahiro Harada on the GPU Open website, revealing details on this new technique.
The use of TSMC’s Small Outline Integrated Circuit Packaging was previously said to be explored by Apple, and there is a chance that the company could take advantage of this technology when introducing its upcoming M5. According to a new report, the company plans to use the same Apple Silicon in its Macs and AI servers, with the advanced packaging technology likely aiding it in achieving that strategy.
AMD's Ryzen 9 9950X, the flagship Zen 5 CPU, reportedly features a maximum frequency or FMAX of up to 5.85 GHz, the same as Zen 4.