Apple’s M5 Could Employ TSMC’s Highly-Advanced SoIC Packaging To Help Fulfill The Company’s Goal Of Using The Same Chip In Macs, And AI Servers
The use of TSMC’s Small Outline Integrated Circuit Packaging was previously said to be explored by Apple, and there is a chance that the company could take advantage of this technology when introducing its upcoming M5. According to a new report, the company plans to use the same Apple Silicon in its Macs and AI servers, with the advanced packaging technology likely aiding it in achieving that strategy.